Fujitsu has developed the world’s first thin cooling unit designed specifically for pocket-sized devices.
With each advance in processor speed, the heat increases as chips are forced to do more processes quicker than each previous processor.
The Fujitsu device, which is less than 1mm thick, will hopefully quell the heat and keep all things pocket-sized things cool.
The new tech was developed using technologies for stacking metal sheets and is simply explained in the diagram below.
Via fareastgizmos
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